Model 650 CVD Deposition System

Specifications

Reactor Specifications
General Deposition rate
Useful deposition area
Power consumption
MTBF
Run turn-around time
Preventive maintenance downtime
Unscheduled downtime
 0.3 to 1.1 micron/hour (recipe and substrate geometry dependent).
900 square centimeters (140 square inches) typical.
Approx. 35 kW plus vacuum pump.
>500 hours.
<1 hour.
Approx. 2% for cleaning and pump maintenance.
<5%.
Process Control Gas control Standard: 4 MFC loops: H2 (5.0 SLM), CH4 , N2, H2 (500 SCCM).
Optional: 5 MFC loops: H2 (5.0 SLM), CH4 , N2, H2 (100 SCCM), Ar.
Recipe control Up to 58 steps AutoMode plus 1 step Manual Mode; real-time display of all parameters; data logging of all exceptions; all parameters adjustable in each step. Ethernet interface for recipe development, storage and management and data file access.
Pressure control Downstream closed loop throttle valve.
User Interface Graphical User Interface, operated via touch-screen display Displays system operational status. Provides system monitoring and control, data logging, and recipe development and storage.
Safety — CE Compliant Hardware interlocks Equipment and personnel protected from hazardous situations related to flammable gas, high voltages and high temperatures. (External flammable gas detector required.)
 
Alarm Name Interlock or Function Device or Limits
Vacuum High Main vacuum valve closed >50 Torr nominal
Main Vacuum Valve Closed No H2, CH4 flows, no filament voltage Switch
Pump Dilution No H2, no CH4 flows Flow sensor
Vacuum Low No filament voltage <5 Torr nominal
H2 Leak Detector No H2, no CH4 flows External input
Low Water Flow No filament voltage Flow sensor
Software interlocks User controlled through Alarm/Abort Levels on analog values and status of digital alarm inputs.
Vacuum Pump
(Optional) 		Pump type
Pump footprint
Cycle time
Operating range
Accuracy
Leak test
Power input		 Alcatel 2063 or equivalent.
30 cm x 86 cm (12 in. x 34 in.).
30 minute pump-down; 10 minute vent.
10 to 50 Torr.
±500 mTorr.
Software controlled, optional on every run.
208 VAC, 3-phase, 4-wire, 15 amp.
Facilities Requirements Footprint
Power input

Cooling water

Access
Process gasses
House nitrogen		 117 cm x 132 cm (48 in. x 54 in. ).
480 VAC 3-phase, 4-wire, 70 Amp.
208 VAC 3-phase, 5-wire, 20 Amp.
10 gpm at 40 psi drop, 20°C maximum.
Water must be treated (consult sp3 for recommendation).
60 cm (24 in.) clearance, all sides.
H2 (99.99%), CH4 (99.9%) and N2 (15 to 20 psi).
N2 for pneumatic actuators (70 psi).
Accessories supplied with Model 650 Deposition System
• Filament array loading fixture.
• Tungsten filament wire, one roll (1000M).
• Filament maker.
• Vacuum accessories kit.
• Tool kit.
Options for Model 650 Deposition System
• Vacuum pump.
• Two-dimensional filament array.
• Three-dimensional filament array.
• Quartz kit, round tool fixturing.
• Substrate tray assembly, molybdenum.
• Substrate tray package, quartz.
• Consumable spares.
Application Fixturing options
Option packages available are:

Planar array deposition package – for flat substrates which require a coating on one planar surface.

Silicon wafer deposition package — for coating wafers: 100mm, 150mm, 200mm, 300mm.

Substrate cooling package — for controlling backside wafer temperature.

Three-dimensional array deposition package – for applications and substrates which require coating in more than one plane.

Flat cutting tool deposition package — for use on all tungsten carbide inserts, grooving tools, engravers,etc.

Round cutting tool deposition package – for coating drills, endmills, countersinks, routers and other rotating tungsten carbide tools.
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Option Package for Planar Array Deposition
Coating Performance Deposition area
Growth rate		 33 cm x 28 cm (13" x 11" ).
0.3 to 1.0 µ/hr (recipe dependent).
Coating Uniformity — ±20% up to 300mm.
Items Included — Molybdenum filament array assembly, 2-dimensional.
Quartz substrate holder.
Substrate tray support assembly.
All required fasteners.
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Option Package for Silicon Wafer Deposition
Specifications in process.
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Option Package for Substrate Cooling
Specifications in process.
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Option Package for Three Dimensional Array Deposition
Coating Performance Deposition area
Growth rate
Target sizes		 33 cm x 28 cm (13" x 11" ).
0.3 to 0.7 µ/hr, recipe dependent.
Up to 1 inch diameter and 3 inches long.
Coating Uniformity — ±20% within optimized envelope.
Items Included — Molybdenum filament array assembly 3-dimensional.
Molybdenum substrate tray.
Substrate tray support assemblies.
All required fasteners.
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Option Package for Flat Cutting Tool Deposition
Coating Performance Deposition area
Growth rate		 33 cm x 28 cm (13" x 11" ).
0.3 to 1.0 µ/hr, recipe dependent.
Coating Uniformity — ±20% run to run and insert to insert.
Items Included — Molybdenum filament array assembly.
Molybdenum substrate tray.
Substrate tray support assemblies.
All required fasteners.
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Option Package for Round Cutting Tool Deposition
Coating Performance Deposition area
Growth rate
Target sizes		 33 cm x 28 cm (13" x 11" ).
0.3 to 0.7 µ/hr, recipe dependent.
Up to 1 inch diameter and 3 inches long.
Coating Uniformity — ±20% at tool tip.
Items Included — Molybdenum filament array assembly.
Tool holder assemblies for tools from 3mm shank to 12mm shank.
Round tool quartz fixture kit.
All required fasteners.
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Warranty and Support
Warranty sp3 warrants the Model 650 Reactor and its components for one year after delivery.
Extended system support is available.
Support Processes, procedures, training, installation, and maintenance are all provided as part of the purchase of a Model 650 Reactor.
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OverviewReactor DescriptionApplicationsDeposition ControlFilm Uniformity