The sp3 Model 650 hot filament diamond deposition system provides uniform diamond growth over areas up to 350mm by 375mm. Using this system, sp3 offers diamond-on-silicon wafers, coated to a variety of specifications.		20 to 25 micron thick diamond on 200 and 300 mm wafers.

General specifications
Wafer diameter	100, 150, 200 and 300mm
Film thickness	0.5 to 3.0µm Thicker films available on special order.
Wafer flatness	Diameter/thickness dependent. Typically ±50 microns on 200mm wafer with 1.0 micron film.
Film thickness uniformity	±10% over specified diameter.
Grain size	Down to 100 nanometers.
Young's modulus	Greater than 1000 Giga Pascals on larger grain films.

Film types
•	Standard diamond films: grain size typically 50% of film thickness, with a strong Raman peak.
•	Very smooth films with grains as small as 100 nm and 20nm Ra roughness can also be grown.
•	Conductive boron doped films.

For price and delivery quotation

please call 877-773-9940 or 408-492-0630